提供专业“一站式”印制线路板(PCB)服务

Material : FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,?Hybrid, etc.

Layers : Max. 40 layers

Max Thickness : 10 mm / 394 mil

Max PCB Size : 1100 * 550 mm / 43.3" * 21"

Surface Finish : HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

Special Process : Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control